17.6.-21.6.
Andrei and Matej were at PSI working on the cap gluing setup
Andrei cap glued M2029 (Box9,T110)
Matej cap glued M2331
M2331 was tested before and after cap gluing
M2233 was taken to Zagreb for irradiatio, cable of the mdule is in Box4, T040
1.7.
HDIs 3019 and 3020 were tested and both failed, results in the HDIresults
Performed characterization on one v4 chip, it will be irradiated in Zagreb and restested
2.7.
Silvan bonded the M1520 so Andrei and Matej performed full qualification on it (-20 and +10) and it took 5 hours
3.7.
Glued caps on 3 dummy modules with 3 different glues.
HDI 1317-3-008 with two component epoxy glue
HDI 1317-3-010 with SG-20 silicon glue
HDI 1317-3-004 with WS-200 silicon glue
4.7.
3 dummy modules taken to Zagreb for irradiation by Matej
M1508 was also taken |