 Thu Oct 31 16:48:51 2019, Matej Roguljic, Module assembly, Phase 2 module gluing - preliminary observations
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1 hour after applying glue to the HDI and gluing it to the sensor + ROCs, we took a look to see if the glue distribution was good. Unfortunately, the very
edges on the long side didn't get glue so they are "bending" away from the sensor. This is bad since the wire bond pads are on these edges and if they're
not properly glued, wire bonding will not be possible.
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Wed Oct 30 16:45:03 2019, Matej Roguljic, General, FC7 nanoCrate assembly 
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| An FC7 nanoCrate was assembled on 30.10.2019. It houses one Imperial College adapter card and one FC7 FPGA board. It will be used for p2 module readout. |
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Wed Oct 30 12:23:08 2019, Matej Roguljic, Module assembly, Phase 2 dummy module gluing 19x
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-Phase 2 dummy module consists of a phase2 HDI, piece of silicon cut to the sensor size and 4 phase2 ROCs. For our first dummy module, 2 ROCs labeled "Red"
were used, 1 labeled "yellow" and 1 labeled "green". The one labeled "green" was put as ROC0 of the module. Procedure is the following:
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